The technological achievement of this 72-Layer 256 Gb 3D NAND compares figuratively to the difficulty of approximately 4 billion 72-storied skyscrapers on a dime. The chip also achieves approximately 30 percent more manufacturing productivity over its predecessor 48-Layer by stacking 1.5 times more cells and utilizing existing mass production facilities. Also by bringing high-speed circuit design into the new chip, its internal operation speed is two times faster and read/write performance is 20 percent higher than a 48-Layer 3D NAND chip.
“With the introduction of this industry’s highest productivity 3D NAND, SK Hynix will mass produce the 256Gb 3D NAND in the second half of this year to provide this to worldwide business clients for optimum use in storage solutions” said vice president Jong Ho Kim, the Head of Marketing Division. “The company plans to expand the usage of the product to SSDs and mobile gadgets such as smart phones to further improve its business structure weighted towards DRAM” he added.
3D NAND demand will rapidly increase across AI(Artificial Intelligence), big data and cloud storage in the 4th industrial revolution. According to Gartner, NAND Flash market revenue is expected to total USD 46.5 billion in this year and post continuous growth to amount to USD 56.5 billion in 2021.